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Industry News provided by Optical Connections

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MPO technology for multi-fibre type solutions

Created March 17, 2017

The MPO, from Sanwa, is designed to be used with their full line of connectors, as well as a stand-alone system. Users can choose from individual components, such as MT ferrules, MPO adapters, MPO connector kits, or an entire assembly in 12-, 24-, or 48-port models.

Key features include a choice of standard and high-grade SM and MM, compliance to IEC, TIA, RoHS, and REACH standards, as well as a flammability rating of UL 94 V-0.



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NeoPhotonics launches 64 GBaud micro-modulator for 400/600G applications

Created March 17, 2017

NeoPhotonics, a developer of optoelectronic solutions for high-speed communications networks, will demonstrate its new 64 GBaud, polarization-multiplexed, quadrature micro-modulator at the forthcoming OFC 2017 conference and exhibition.

The Micro-MOD is implemented in a small form factor (3.9x27x13 mm) package, which co-packages a quad-channel, differential 64 GBaud driver with an indium phosphide-based Mach-Zehnder quadrature modulator chip.



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II‐VI launching mini tunable optical filter for high bitrate DWDM

Created March 17, 2017

II‐VI has announced a miniature tunable optical filter for high bit rate DWDM transmission applications. To satisfy the continuing demand for increased capacity in metro, regional and long‐haul networks, as well as datacenter interconnects, system designers are employing advanced modulation formats such as 64QAM with Nyquist filtering to increase the per‐channel bandwidth from 100 to 400 Gb/s.



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Senko unveils news Micro LC connector

Created March 16, 2017

Senko’s Micro LC connector provides an ideal solution for behind-the-wall (BTW) applications, plug and play modules and on board optics, where space saving is paramount.  Using a conventional LC ferrule, with a spring loaded design, the connector mates with all standard LC connectors.



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3-micron die bonder, from MRSI Systems

Created March 15, 2017

The highly configurable, MRSI-M3 platform provides 3-micron accuracy, automation, speed and reliability, in-situ assembly processes such as eutectic die bonding. UV epoxy die attach and flip chip assembly are also possible.

From small dies to large sensors, the MRSI-M3 3-micron die bonder provides all the capability and flexibility to assemble the most advanced packages, without compromising on manufacturing efficiency, quality and reliability.



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The Skygate by Skylane Optics

Created March 14, 2017

The Skygate is a brand new solution, provided and managed by Skylane Optics®, enabling end users to modify the compatibility of transceivers by themselves. With this tool, the customer can configure a variety of transceiver types (e.g. SFP/ SFP+/SFP28, XFP, QSFP+/QSFP28) for equipment from a majority of switch vendors on the market and thanks to its user-friendly design, the Skygate can be used anywhere, any time.



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Huawei brings it all back home for Andorra

Created March 14, 2017

Andorra Telecom has tapped Huawei to upgrade its FTTH network, evolving it from EPON to GPON, in the process upping Internet access speeds initially to 300 Mbits/s.

The upgrade is based on the Chinese vendor’s distributed OLT MA5800. According to Huawei, the OLT supports not only high-speed GPON Internet access, but also provides a smooth evolution to NG-PON (XGS-PON, TWDM-PON) which can deliver up to 10 Gbits/s.



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enet nets UK fibre presence

Created March 14, 2017

enet, Ireland’s largest open-access network operator, has made its first entry into the UK market with a strategic network partnership with the UK’s SSE Enterprise Telecoms.

Under the terms of the tie-up, enet will utilise SSE Enterprise Telecoms’ full range of dark fibre, Carrier Ethernet and optical networking services across 13,700 km of national network. Additionally, enet also gains access to over 265 Points of Presence (PoPs), with further expansion planned over the next 12 months, as well as over 76 UK on-net commercial data centres and over 2,000 PoPs from other players in the market.



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Seikoh Giken launches Intelli-Cross LC Uniboot connector

Created March 14, 2017

Seikoh Giken is launching at OFC 2017 the Intelli-Cross Series LC Uniboot interconnect range, which is designed for next-generation single and multimode fibre connectivity applications. With an ultra-compact, low-profile form factor, these connectors incorporate a micro-gear mechanism that intelligently syncs the A-B housing keys during polarity reconfigurations.



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Exfo acquires Ontology Systems for $7.6 million

Created March 14, 2017

Acquisition strengthens Exfo’s offering in service assurance and 3D analytics for hybrid physical-virtual networks.

Exfo, a network test, data and analytics company, has acquired the privately-held Ontology Systems, based in London, UK, a developer of real-time network topology discovery and service-chain mapping, for a total consideration of US$7.6 million, net of cash. Ontology uses graph-data and semantic searches to build real-time views of network services and related network elements.



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